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[市政设计] LED照明常用英文词汇(1-3全)

 

技术分享 技术分享 1003 人阅读 | 2 人回复 | 2011-01-03

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1 backplane 背板
     2 Band gap voltage reference 带隙电压参考

     3 benchtop supply 工作台电源

     4 Block Diagram 方块图 5 Bode Plot 波特图

     6 Bootstrap 自举

     7 Bottom FET Bottom FET

     8 bucket capcitor 桶形电容

     9 chassis 机架

     10 Combi-sense Combi-sense

    11 constant current source 恒流源

     12 Core Sataration 铁芯饱和

     13 crossover frequency 交叉频率

     14 current ripple 纹波电流

     15 Cycle by Cycle 逐周期

     16 cycle skipping 周期跳步

     17 Dead Time 死区时间

     18 DIE Temperature 核心温度

     19 Disable 非使能,无效,禁用,关断

     20 dominant pole 主极点

    21 Enable 使能,有效,启用

     22 ESD Rating ESD额定值

     23 Evaluation Board 评估板

     24 Exceeding the specifications below may result in permanent damage to the device, or device malfunction. Operation outside of the parameters specified in the Electrical Characteristics section is not implied. ; 超过下面的规格使用可能引起永久的设备损害或设备故障。建议不要工作在电特性表规定的参数范围以外。

     25 Failling edge 下降沿

     26 figure of merit 品质因数

     27 float charge voltage 浮充电压

     28 flyback power stage 反驰式功率级

     29 forward voltage drop 前向压降

     30 free-running 自由运行

    31 Freewheel diode 续流二极管

     32 Full load 满负载 33 gate drive 栅极驱动

     34 gate drive stage 栅极驱动级

     35 gerber plot Gerber 图

36 ground plane 接地层

     37 Henry 电感单位:亨利

     38 Human Body Model 人体模式

     39 Hysteresis 滞回

     40 inrush current 涌入电流

     41 Inverting 反相

     42 jittery 抖动

     43 Junction 结点

     44 Kelvin connection 开尔文连接

     45 Lead Frame 引脚框架

     46 Lead Free 无铅

     47 level-shift 电平移动

     48 Line regulation 电源调整率

     49 load regulation 负载调整率

     50 Lot Number 批号

    51 Low Dropout 低压差

     52 Miller 密勒 53 node 节点

     54 Non-Inverting 非反相

     55 novel 新颖的

     56 off state 关断状态

     57 Operating supply voltage 电源工作电压

     58 out drive stage 输出驱动级

     59 Out of Phase 异相

     60 Part Number 产品型号

    61 pass transistor pass transistor

     62 P-channel MOSFET P沟道MOSFET

     63 Phase margin 相位裕度

     64 Phase Node 开关节点

     65 portable electronics 便携式电子设备

     66 power down 掉电

     67 Power Good 电源正常

     68 Power Groud 功率地

     69 Power Save Mode 节电模式

     70 Power up 上电

71 pull down 下拉

     72 pull up 上拉

     73 Pulse by Pulse 逐脉冲(Pulse by Pulse)

     74 push pull converter 推挽转换器

     75 ramp down 斜降

     76 ramp up 斜升

     77 redundant diode 冗余二极管

     78 resistive divider 电阻分压器

     79 ringing 振 铃

     80 ripple current 纹波电流

    81 rising edge 上升沿

     82 sense resistor 检测电阻

     83 Sequenced Power Supplys 序列电源

     84 shoot-through 直通,同时导通

     85 stray inductances. 杂散电感

     86 sub-circuit 子电路

     87 substrate 基板

     88 Telecom 电信

     89 Thermal Information 热性能信息

     90 thermal slug 散热片

    91 Threshold 阈值

     92 timing resistor 振荡电阻

     93 Top FET Top FET

     94 Trace 线路,走线,引线

     95 Transfer function 传递函数

     96 Trip Point 跳变点

     97 turns ratio 匝数比,=Np / Ns。(初级匝数/次级匝数)

     98 Under Voltage Lock Out (UVLO) 欠压锁定

     99 Voltage Reference 电压参考

     100 voltage-second product 伏秒积

    101 zero-pole frequency compensation 零极点频率补偿

     102 beat frequency 拍频

     103 one shots 单击电路

     104 scaling 缩放

     105 ESR 等效串联电阻 [Page]

     106 Ground 地电位

     107 trimmed bandgap 平衡带隙

     108 dropout voltage 压差

     109 large bulk capacitance 大容量电容

     110 circuit breaker 断路器

     111 charge pump 电荷泵

     112 overshoot 过冲

回答|共 2 个

dagongcheng

dagongcheng 发表于 2011-1-3 12:51:00 | 显示全部楼层

1) 元件设备
    三绕组变压器:three-column transformer ThrClnTrans

     双绕组变压器:double-column transformer DblClmnTrans

     电容器:Capacitor

     并联电容器:shunt capacitor

     电抗器:Reactor

     母线:Busbar

     输电线:TransmissionLine

     发电厂:power plant

    断路器:Breaker

     刀闸(隔离开关):Isolator

     分接头:tap

     电动机:motor

    2) 状态参数

    有功:active power

     无功:reactive power

     电流:current

     容量:capacity

     电压:voltage

     档位:tap position

     有功损耗:reactive loss

     无功损耗:active loss

     功率因数:power-factor

     功率:power

     功角:power-angle

     电压等级:voltage grade

     空载损耗:no-load loss

     铁损:iron loss

     铜损:copper loss

     空载电流:no-load current

     阻抗:impedance



   正序阻抗:positive sequence impedance

     负序阻抗:negative sequence impedance

     零序阻抗:zero sequence impedance

     电阻:resistor

     电抗:reactance

     电导:conductance

     电纳:susceptance

     无功负载:reactive load 或者QLoad

     有功负载: active load PLoad

     遥测:YC(telemetering)

     遥信:YX

     励磁电流(转子电流):magnetizing current

     定子:stator

     功角:power-angle

     上限:upper limit

     下限:lower limit

     并列的:apposable

     高压: high voltage

     低压:low voltage

     中压:middle voltage

     电力系统 power system

     发电机 generator



励磁 excitation

     励磁器 excitor

     电压 voltage

     电流 current

     母线 bus

     变压器 transformer

     升压变压器 step-up transformer

     高压侧 high side

     输电系统 power transmission system

     输电线 transmission line

     固定串联电容补偿fixed series capacitor compensation

     稳定 stability

     电压稳定 voltage stability

     功角稳定 angle stability

     暂态稳定 transient stability

     电厂 power plant

     能量输送 power transfer

     交流 AC

     装机容量 installed capacity

     电网 power system

     落点 drop point

     开关站 switch station

     双回同杆并架 double-circuit lines on the same tower

     变电站 transformer substation

     补偿度 degree of compensation

     高抗 high voltage shunt reactor

     无功补偿 reactive power compensation

     故障 fault

     调节 regulation

     裕度 magin

     三相故障 three phase fault

     故障切除时间 fault clearing time

     极限切除时间 critical clearing time

     切机 generator triping

     高顶值 high limited value

     强行励磁 reinforced excitation

     线路补偿器 LDC(line drop compensation)

     机端 generator terminal

     静态 static (state)

     动态 dynamic (state)

     单机无穷大系统 one machine - infinity bus system

机端电压控制 AVR

     电抗 reactance

     电阻 resistance

     功角 power angle

     有功(功率) active power

     无功(功率) reactive power

     功率因数 power factor

     无功电流 reactive current

     下降特性 droop characteristics

     斜率 slope

     额定 rating

     变比 ratio

     参考值 reference value

     电压互感器 PT

     分接头 tap

     下降率 droop rate

     仿真分析 simulation analysis

     传递函数 transfer function

     框图 block diagram

     受端 receive-side

     裕度 margin

     同步 synchronization

     失去同步 loss of synchronization

     阻尼 damping

     摇摆 swing

     保护断路器 circuit breaker

     电阻:resistance

     电抗:reactance

     阻抗:impedance

     电导:conductance

     电纳:susceptance

     导纳:admittance

     电感:inductance

     电容: capacitance

dagongcheng

dagongcheng 发表于 2011-1-3 12:51:21 | 显示全部楼层

印制电路printed circuit
     印制线路 printed wiring

     印制板 printed board

     印制板电路 printed circuit board

     印制线路板 printed wiring board

     印制元件 printed component

     印制接点 printed contact

     印制板装配 printed board assembly

     板 boardnbsp;

     刚性印制板 rigid printed board

    挠性印制电路 flexible printed circuit

     挠性印制线路 flexible printed wiring

     齐平印制板 flush printed board

     金属芯印制板 metal core printed board

     金属基印制板 metal base printed board

     多重布线印制板 mulit-wiring printed board

     塑电路板 molded circuit board

     散线印制板 discrete wiring board

     微线印制板 micro wire board

     积层印制板 buile-up printed board

     表面层合电路板 surface laminar circuit

     埋入凸块连印制板 B2it printed board

     载芯片板 chip on board

     埋电阻板 buried resistance board

     母板 mother board

     子板 daughter board

     背板 backplane

     裸板 bare board

     键盘板夹心板 copper-invar-copper board

     动态挠性板 dynamic flex board

     静态挠性板 static flex board

     可断拼板 break-away planel

     电缆 cable

     挠性扁平电缆 flexible flat cable (FFC)

     薄膜开关 membrane switch

     混合电路 hybrid circuit

     厚膜 thick film

     厚膜电路 thick film circuit

     薄膜 thin film

     薄膜混合电路 thin film hybrid circuit

互连 interconnection

     导线 conductor trace line

     齐平导线 flush conductor

     传输线 transmission line

     跨交 crossover

     板边插头 edge-board contact

     增强板 stiffener

     基底 substrate

     基板面 real estate

     导线面 conductor side

     元件面 component side

     焊接面 solder side

     导电图形 conductive pattern

     非导电图形 non-conductive pattern

     基材 base material

     层压板 laminate

     覆金属箔基材 metal-clad bade material

     覆铜箔层压板 copper-clad laminate (CCL)

     复合层压板 composite laminate

     薄层压板 thin laminate

     基体材料 basis material

     预浸材料 prepreg

     粘结片 bonding sheet

     预浸粘结片 preimpregnated bonding sheer

     环氧玻璃基板 epoxy glass substrate

     预制内层覆箔板 mass lamination panel

     内层芯板 core material

     粘结层 bonding layer

     粘结膜 film adhesive

     无支撑胶粘剂膜 unsupported adhesive film

     覆盖层 cover layer (cover lay)

     增强板材 stiffener material

     铜箔面 copper-clad surface

     去铜箔面 foil removal surface

     层压板面 unclad laminate surface

     基膜面 base film surface

     胶粘剂面 adhesive faec

     原始光洁面 plate finish

     粗面 matt finish

     剪切板 cut to size panel

     超薄型层压板 ultra thin laminate

     A阶树脂 A-stage resin

     B阶树脂 B-stage resin

     C阶树脂 C-stage resin

     环氧树脂 epoxy resin

     酚醛树脂 phenolic resin

     聚酯树脂 polyester resin

     聚酰亚胺树脂 polyimide resin

     双马来酰亚胺三嗪树脂 bismaleimide-triazine resin

     丙烯酸树脂 acrylic resin

     三聚氰胺甲醛树脂 melamine formaldehyde resin

     多官能环氧树脂 polyfunctional epoxy resin

     溴化环氧树脂 brominated epoxy resin

     环氧酚醛 epoxy novolac

     氟树脂 fluroresin

     硅树脂 silicone resin

     硅烷 silane

     聚合物 polymer

     无定形聚合物 amorphous polymer

     结晶现象 crystalline polamer

     双晶现象 dimorphism

     共聚物 copolymer

     合成树脂 synthetic

     热固性树脂 thermosetting resin [Page]

     热塑性树脂 thermoplastic resin

     感光性树脂 photosensitive resin

     环氧值 epoxy value

     双氰胺 dicyandiamide

     粘结剂 binder

     胶粘剂 adesive

     固化剂 curing agent

     阻燃剂 flame retardant



遮光剂 opaquer

     增塑剂 plasticizers

     不饱和聚酯 unsatuiated polyester

     聚酯薄膜 polyester

     聚酰亚胺薄膜 polyimide film (PI)

     聚四氟乙烯 polytetrafluoetylene (PTFE)

     增强材料 reinforcing material

     折痕 crease

     云织 waviness

     鱼眼 fish eye

     毛圈长 feather length

     厚薄段 mark

     裂缝 split

     捻度 twist of yarn

     浸润剂含量 size content

     浸润剂残留量 size residue

     处理剂含量 finish level

     偶联剂 couplint agent

     断裂长 breaking length

     吸水高度 height of capillary rise

     湿强度保留率 wet strength retention

     白度 whitenness

     导电箔 conductive foil

     铜箔 copper foil

     压延铜箔 rolled copper foil

     光面 shiny sidenbsp;

     粗糙面 matte sidenbsp;

     处理面 treated sidenbsp;

     防锈处理 stain proofingnbsp;

     双面处理铜箔 double treated foilnbsp;

     模拟 simulation

     逻辑模拟 logic simulation

     电路模拟 circit simulation

     时序模拟 timing simulation

     模块化 modularization

     设计原点 design origin

     优化(设计) optimization (design)

     供设计优化坐标轴 predominant axis

     表格原点 table origin

     元件安置 component positioning

     比例因子 scaling factor

     扫描填充 scan filling

     矩形填充 rectangle filling

     填充域 region filling

     实体设计 physical design

     逻辑设计 logic design

     逻辑电路 logic circuit

     层次设计 hierarchical design

     自顶向下设计 top-down design

     自底向上设计 bottom-up design

     费用矩阵 cost metrix

     元件密度 component density

     自由度 degrees freedom

     出度 out going degree

     入度 incoming degree

     曼哈顿距离 manhatton distance

     欧几里德距离 euclidean distance

     网络 network

     阵列 array

     段 segment

     逻辑 logic

     逻辑设计自动化 logic design automation

     分线 separated time

     分层 separated layer



定顺序 definite sequence

     导线(通道) conduction (track)

     导线(体)宽度 conductor width

     导线距离 conductor spacing

     导线层 conductor layer

     导线宽度/间距 conductor line/space

     第一导线层 conductor layer No.1

     圆形盘 round pad

     方形盘 square pad

     菱形盘 diamond pad

     长方形焊盘 oblong pad

     ****形盘 bullet pad

     泪滴盘 teardrop pad

     雪人盘 snowman pad

     形盘 V-shaped pad V

     环形盘 annular pad

     非圆形盘 non-circular pad

     隔离盘 isolation pad

     非功能连接盘 monfunctional pad

     偏置连接盘 offset land

     腹(背)裸盘 back-bard land

     nbsp;盘址 anchoring spaur

     连接盘图形 land pattern

     连接盘网格阵列 land grid array

     孔环 annular ring

     元件孔 component hole

     安装孔 mounting hole

     支撑孔 supported hole

     非支撑孔 unsupported hole

     导通孔 via

     镀通孔 plated through hole (PTH)

     余隙孔 access hole

     盲孔 blind via (hole)

     埋孔 buried via hole

     埋,盲孔 buried blind via

     任意层内部导通孔 any layer inner via hole

     全部钻孔 all drilled hole

     定位孔 toaling hole

     无连接盘孔 landless hole

     中间孔 interstitial hole

     无连接盘导通孔 landless via hole

     引导孔 pilot hole

     端接全隙孔 terminal clearomee hole

     准尺寸孔 dimensioned hole [Page]

     在连接盘中导通孔 via-in-pad

     孔位 hole location

     孔密度 hole density

     孔图 hole pattern

     钻孔图 drill drawing

     装配图assembly drawingnbsp;

     参考基准 datum referan
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